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CPU BLOCK DIAGRAM
CORE BOARD BLOCK DIAGRAM
PRODUCT DISPLAY
HARDWARE INDEX
Main hardware indicators | |
size | 60mm long*40mm wide*4.7mm high |
Connection method | B2B board to board connector |
CPU | ROCKCHIP RK3575 Octa-core A72+A53 |
NPU | 6 TOPS |
GPU | Mali G52 MC3 |
Memory | LPDDR4x optional 2G/4G/8G/16G |
memory | EMMC 5.1 standard 8GB, optional 32G/64G/128G |
memory | UFS V2.0 standard 64GB, optional 128G-512G |
Power management | RK806S-5 |
Working voltage | 3.4-5.5V Maximum design current 3A |
Support system | Andriod14 |
working temperature | -10 to +75 degrees |
COMMONINTERFACE
Common interfaces for core boards | |
HDMI | 1 HDMI high-definition output supports up to 4K display |
EDP | 1 channel 4Lane eDP up to 1080P |
DP | 1 channel 4Lane DP up to 4K |
MIPI DSI | 1 channel MIPI DSI supports up to 2K |
MIPI CSI | 5-way MIPI CAMERA CSI input ISP 1600W |
I2S | 5-way I2S |
PCIE | 2-way PCIE 2.0 |
SATA | 2-way SATA3.0 |
USB2.0 | 2 independent USB2.0 channels, one of which is OTG |
USB3.0 | 2-way USB 3.0 interface (shared with DP) |
Ethernet | 2-way RGMII Ethernet interface |
UART | 12-way serial port |
SPI | 5-way SPI |
I2C | 9-way I2C |
PWM | 16-way PWM |
SDIO | 2 SDIO interfaces (one TF card) |
ADC | 8-channel analog ADC input interface |
CAN | 2-way CAN FD bus |
GPIO | Reusable GPIO up to 132 |
Infrared reception | 2-way IR infrared receiver |
upgrade | Support USB/TF card local upgrade |
CORRENT PARAMETER TABLE
project | smallest | typical | maximum | |
Power parameters | Voltage | 11V | 12V | 15V |
ripple | 50mV | |||
3V RTC power consumption | 0.9uA | |||
Boot current (no screen) | 155mA | 212mA | 665mA | |
Desktop quiescent current (no screen) | 206mA | |||
Boot current (connected to 7-inch 720x1280) | 245mA | 295mA | 695mA | |
Desktop quiescent current (connected to 7-inch 720x1280) | 285mA | |||
environment | relative humidity | -- | 65% | 75% |
working temperature | -10℃ | -- | 75℃ | |
Storage temperature | -30℃ | -0℃ | 100℃ | |
CPU BLOCK DIAGRAM
CORE BOARD BLOCK DIAGRAM
PRODUCT DISPLAY
HARDWARE INDEX
Main hardware indicators | |
size | 60mm long*40mm wide*4.7mm high |
Connection method | B2B board to board connector |
CPU | ROCKCHIP RK3575 Octa-core A72+A53 |
NPU | 6 TOPS |
GPU | Mali G52 MC3 |
Memory | LPDDR4x optional 2G/4G/8G/16G |
memory | EMMC 5.1 standard 8GB, optional 32G/64G/128G |
memory | UFS V2.0 standard 64GB, optional 128G-512G |
Power management | RK806S-5 |
Working voltage | 3.4-5.5V Maximum design current 3A |
Support system | Andriod14 |
working temperature | -10 to +75 degrees |
COMMONINTERFACE
Common interfaces for core boards | |
HDMI | 1 HDMI high-definition output supports up to 4K display |
EDP | 1 channel 4Lane eDP up to 1080P |
DP | 1 channel 4Lane DP up to 4K |
MIPI DSI | 1 channel MIPI DSI supports up to 2K |
MIPI CSI | 5-way MIPI CAMERA CSI input ISP 1600W |
I2S | 5-way I2S |
PCIE | 2-way PCIE 2.0 |
SATA | 2-way SATA3.0 |
USB2.0 | 2 independent USB2.0 channels, one of which is OTG |
USB3.0 | 2-way USB 3.0 interface (shared with DP) |
Ethernet | 2-way RGMII Ethernet interface |
UART | 12-way serial port |
SPI | 5-way SPI |
I2C | 9-way I2C |
PWM | 16-way PWM |
SDIO | 2 SDIO interfaces (one TF card) |
ADC | 8-channel analog ADC input interface |
CAN | 2-way CAN FD bus |
GPIO | Reusable GPIO up to 132 |
Infrared reception | 2-way IR infrared receiver |
upgrade | Support USB/TF card local upgrade |
CORRENT PARAMETER TABLE
project | smallest | typical | maximum | |
Power parameters | Voltage | 11V | 12V | 15V |
ripple | 50mV | |||
3V RTC power consumption | 0.9uA | |||
Boot current (no screen) | 155mA | 212mA | 665mA | |
Desktop quiescent current (no screen) | 206mA | |||
Boot current (connected to 7-inch 720x1280) | 245mA | 295mA | 695mA | |
Desktop quiescent current (connected to 7-inch 720x1280) | 285mA | |||
environment | relative humidity | -- | 65% | 75% |
working temperature | -10℃ | -- | 75℃ | |
Storage temperature | -30℃ | -0℃ | 100℃ | |
Product Show Case